ICTACT Journal on Microelectronics

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Design and Analysis of UWB Rectangular Slot Microstrip Patch Antenna for Smart Implant Application


Affiliations
1 Department of Electronics and Communication Engineering, PET Engineering College, India
     

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Microstrip patch antennas are recently used in implant applications due to their low power consumption, low cost, versatility, field excitation, ease of fabrication etc. The microstrip patch antenna suffers with an array elements of antenna and narrow bandwidth. To overcome the above drawbacks, Flame Retardant Material is used as the substrate. Rectangular shape of microstrip patch antenna with FR4 material as the substrate which is more suitable for the implant applications. The proposed microstrip patch antenna was designed with the dimension of 20×26mm2. FR-4 material has a dielectric constant value of 4.4 with thickness 1.4mm. One side of the substrate contains the ground plane of dimensions 20×26mm2 made of copper and the backside of the substrate contains the ground plane of dimensions 20×26mm2 made up of copper. The top of the substrate is the patch copper with dimensions 12×12.5mm2 and thickness 0.05mm. MPA without slot, Vertical slot MPA, Horizontal slot MPA and Cylindrical slot MPA structures were designed and the performance of the antenna were analyzed with various parameters such as gain, directivity, E-field, VSWR and return loss. From the performance analysis, horizontal slot antenna provides a better result and it provides maximum E-field of 20dBV/m at 10.846GHz and MPA without slot produces low return loss of -36.539dB. Furthermore, successfully access the response of an antenna embedded in a tooth, mimicking a dental implant. Based on the E-field excitation value the investigating the tooth decay and it was simulated using CST software.

Keywords

Gain, Directivity, Return Loss, E-Field, H-Field.
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  • Design and Analysis of UWB Rectangular Slot Microstrip Patch Antenna for Smart Implant Application

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Authors

P. Saraswathy
Department of Electronics and Communication Engineering, PET Engineering College, India
K. Madhan Kumar
Department of Electronics and Communication Engineering, PET Engineering College, India

Abstract


Microstrip patch antennas are recently used in implant applications due to their low power consumption, low cost, versatility, field excitation, ease of fabrication etc. The microstrip patch antenna suffers with an array elements of antenna and narrow bandwidth. To overcome the above drawbacks, Flame Retardant Material is used as the substrate. Rectangular shape of microstrip patch antenna with FR4 material as the substrate which is more suitable for the implant applications. The proposed microstrip patch antenna was designed with the dimension of 20×26mm2. FR-4 material has a dielectric constant value of 4.4 with thickness 1.4mm. One side of the substrate contains the ground plane of dimensions 20×26mm2 made of copper and the backside of the substrate contains the ground plane of dimensions 20×26mm2 made up of copper. The top of the substrate is the patch copper with dimensions 12×12.5mm2 and thickness 0.05mm. MPA without slot, Vertical slot MPA, Horizontal slot MPA and Cylindrical slot MPA structures were designed and the performance of the antenna were analyzed with various parameters such as gain, directivity, E-field, VSWR and return loss. From the performance analysis, horizontal slot antenna provides a better result and it provides maximum E-field of 20dBV/m at 10.846GHz and MPA without slot produces low return loss of -36.539dB. Furthermore, successfully access the response of an antenna embedded in a tooth, mimicking a dental implant. Based on the E-field excitation value the investigating the tooth decay and it was simulated using CST software.

Keywords


Gain, Directivity, Return Loss, E-Field, H-Field.

References