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Micro Capacitive Pressure Sensor Using Polymumps Process


Affiliations
1 Central Manufacturing Technology Institute, Bangalore, India
     

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The work presented in this paper involves design, analysis and simulation of micro fixed-fixed beam as a capacitive pressure sensor which is designed by using PolyMUMPs: Polysilicon Multi User MEMS Process. By applying a pressure on the top of fixed-fixed beam, the mechanical force pulls the beam down and increases the capacitance. The change in length of the beam influences the range of applied pressure while the effect of beam width on this is negligible. The PolyMUMPs was developed by MEMSCAP foundry focusing on the fabrication, reliability and cost effectiveness. This presented MEMS pressure sensor is capable of measuring pressure between 0.1MPa to 1.7 MPa which is useful in various field of applications.

Keywords

Polymumps, MEMS, Beam, Pressure Sensor.
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  • Micro Capacitive Pressure Sensor Using Polymumps Process

Abstract Views: 225  |  PDF Views: 1

Authors

Megha Agrawal
Central Manufacturing Technology Institute, Bangalore, India
G. V. Anusha
Central Manufacturing Technology Institute, Bangalore, India
N. Kusuma
Central Manufacturing Technology Institute, Bangalore, India
P. V. Shashikumar
Central Manufacturing Technology Institute, Bangalore, India

Abstract


The work presented in this paper involves design, analysis and simulation of micro fixed-fixed beam as a capacitive pressure sensor which is designed by using PolyMUMPs: Polysilicon Multi User MEMS Process. By applying a pressure on the top of fixed-fixed beam, the mechanical force pulls the beam down and increases the capacitance. The change in length of the beam influences the range of applied pressure while the effect of beam width on this is negligible. The PolyMUMPs was developed by MEMSCAP foundry focusing on the fabrication, reliability and cost effectiveness. This presented MEMS pressure sensor is capable of measuring pressure between 0.1MPa to 1.7 MPa which is useful in various field of applications.

Keywords


Polymumps, MEMS, Beam, Pressure Sensor.