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Characterization of Cu-PVA Nanofluids:Ultrasonic and Thermal Properties


Affiliations
1 Mahatma Gandhi Chitrakoot Gramodaya Vishwavidyalaya, Satna-485334, India
2 Amity School of Engineering and Technology (Affiliated to GGSIP University), Bijwasan, New Delhi-110061, India
3 University of Allahabad, Allahabad-211002, India
4 B.S.N.V.P.G. College (University of Lucknow) Charbagh, Lucknow-226001, India
5 Mahatma Gandhi Chitrakoot Gramoday Vishwavidyalaya, Satna-485334, India
 

Nanofluids have unique features different from conventional solid-liquid mixtures which have millimeter or micrometer sized particles dispersed in some base fluid. Due to their excellent characteristics, these new types of fluids have attracted wide interest in recent years. It is found that nanofluids have significantly higher thermal conductivity than the base fluids. In this work we focus on the ultrasonic and thermal properties of nanofluids. Nanofluids containing copper nanoparticles with base fluid polyvinyl alcohol (PVA) have been developed in our laboratory. These nanofluids are characterized by UV-Visible spectroscopy, X-ray diffraction (XRD) and transmission electron microscopy (TEM). Temperature dependent ultrasonic velocity and ultrasonic attenuation measurements are performed for different concentration of the copper nanoparticles in the PVA. Hot Disk Thermal Constant Analyser is used for the measurement of the thermal conductivity of synthesized nanofluids. Experimental results show that the thermal conductivities of the nanofluids are higher than that of base fluid PVA. The obtained results were analyzed taking into account the ultrasonic and thermal behavior of matrix and particles. Possible mechanism for the enhancement of thermal conductivity of the nanofluids using theoretical model is also discussed.

Keywords

Nanofluids, Ultrasonic Properties, Enhanced Heat Transfer, Effective Thermal Conductivity, Brownian Motion.
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  • Characterization of Cu-PVA Nanofluids:Ultrasonic and Thermal Properties

Abstract Views: 221  |  PDF Views: 9

Authors

Vimal Pandey
Mahatma Gandhi Chitrakoot Gramodaya Vishwavidyalaya, Satna-485334, India
Giridhar Mishra
Amity School of Engineering and Technology (Affiliated to GGSIP University), Bijwasan, New Delhi-110061, India
Meher Wan
University of Allahabad, Allahabad-211002, India
Devraj Singh
Amity School of Engineering and Technology (Affiliated to GGSIP University), Bijwasan, New Delhi-110061, India
A. K. Tiwari
B.S.N.V.P.G. College (University of Lucknow) Charbagh, Lucknow-226001, India
R. R. Yadav
University of Allahabad, Allahabad-211002, India
Bharat Mishra
Mahatma Gandhi Chitrakoot Gramoday Vishwavidyalaya, Satna-485334, India

Abstract


Nanofluids have unique features different from conventional solid-liquid mixtures which have millimeter or micrometer sized particles dispersed in some base fluid. Due to their excellent characteristics, these new types of fluids have attracted wide interest in recent years. It is found that nanofluids have significantly higher thermal conductivity than the base fluids. In this work we focus on the ultrasonic and thermal properties of nanofluids. Nanofluids containing copper nanoparticles with base fluid polyvinyl alcohol (PVA) have been developed in our laboratory. These nanofluids are characterized by UV-Visible spectroscopy, X-ray diffraction (XRD) and transmission electron microscopy (TEM). Temperature dependent ultrasonic velocity and ultrasonic attenuation measurements are performed for different concentration of the copper nanoparticles in the PVA. Hot Disk Thermal Constant Analyser is used for the measurement of the thermal conductivity of synthesized nanofluids. Experimental results show that the thermal conductivities of the nanofluids are higher than that of base fluid PVA. The obtained results were analyzed taking into account the ultrasonic and thermal behavior of matrix and particles. Possible mechanism for the enhancement of thermal conductivity of the nanofluids using theoretical model is also discussed.

Keywords


Nanofluids, Ultrasonic Properties, Enhanced Heat Transfer, Effective Thermal Conductivity, Brownian Motion.