Open Access Open Access  Restricted Access Subscription Access

Effect of Geometrical and Physical parameters of AlGaN/GaN HEMT on the electrical characteristics with AlN spacer layer


Affiliations
1 Faculty of Science and Technology, Tissemsilt University, Algeria
2 Laboratoire de Micro-électronique Appliquée. Université Djillali Liabès de Sidi Bel Abbés, BP 89, 22000, Sidi Bel Abbés, Algeria
 

The goal of this manuscript is to use the Silvaco Atlas TCAD simulator to investigate the effect of some parameters on the current-voltage characteristics of a high-electronmobility transistors devices based on AlxGa1-xN/GaN, Advanced AlxGa1-xN/AlN/GaN heterostructures with GaN channel layer and AlN spacer layer. It is demonstrated that numerical simulation can be used effectively in the development of HEMTs. We looked into the effect of the GaN thickness layer on the current-voltage characteristics, as well as the effect of the δ -doped layer within AlxGa1-xN barrier layer, the effect of the spacer thickness is also considered. Among the sample structures we used for our computations, our calculations reveal a low threshold voltage value and the maximum transconductance. Our structure with GaN channel layer thickness of 200 nm, Al content of x = 0.2 with a δ -doped layer of n = 5 x 1018 cm -3 , we find that the maximum saturation current.

Keywords

: Silvaco Atlas TCAD, AlxGa1−xN/GaN,δ-doped layer,HEMTs, AlN .
User
Notifications
Font Size

  • H. Morkoç, S. Strite, G. B. Gao, M. E. Lin, B. Sverdlov, and M. Burns, “Large-band-gap SiC, III-V nitride, and II-VI ZnSebased semiconductor device technologies,” J. Appl. Phys., vol. 76, no. 3, pp. 1363–1398, 1994.
  • P.Perlin, A.Polian, J.P.Itie, I.Grzegory,E.LitwinStaszewska, T.Suskia, “ Physical properties of GaN and AlN under pressures up to 0.5 Mbar ” Physica B: Condensed Matter Volume 185, 426-427,1993.
  • Y. Dora, A. Chakraborty, L. McCarthy, S. Keller, S. P. Denbaars, and U. K. Mishra, “High breakdown voltage achieved on AlGaN/GaN HEMTs with integrated slant field plates,” IEEE Electron Device Lett., vol. 27, no. 9, pp. 713–715, 2006.
  • Y. Wang, Y. Ding, and Y. Yin, “Reliability of Wide Band Gap Power Electronic Semiconductor and Packaging: A Review ” Energies 2022, 15, 6670.
  • X. Huang, P. Jiang, and T. Tanaka, “A review of dielectric polymer composites with high thermal conductivity,” IEEE Electr. Insul. Mag., vol. 27, no. 4, pp. 8–16, 2011.
  • S. Arulkumaran, S. Vicknesh, G. I. Ng, Z. H. Liu, S. L. Selvaraj, and T. Egawa, “High vertical breakdown strength in with low specific on-resistance AlGaN/AlN/GaN HEMTs on silicon,” Phys. Status Solidi - Rapid Res. Lett., vol. 5, no. 1, pp. 37–39, 2011.
  • F. Giannazzo et al., “HighPerformance Graphene/AlGaN/GaN Schottky Junctions for Hot Electron Transistors,” ACS Appl. Electron. Mater., vol. 1, no. 11, pp. 2342–2354, 2019,
  • M. Rudolph, N. Chaturvedi, K. Hirche, J. Würfl, W. Heinrich, and G. Tränkle, “Highly rugged 30 GHz GaN low-noise amplifiers,” IEEE Microw. Wirel. Components Lett., vol.
  • , no. 4, pp. 251–253, 2009. [9] A. Ballestín-Fuertes, , J. MuñozCruzado-Alba , José F. SanzOsorio, and Erika Laporta-Puya “Role of Wide Bandgap Materials in Power Electronics for Smart Grids Applications”, Electronics 2021, 10, 677.
  • D. W. Runton, B. Trabert, J. Shealy, and R. Vetury, “History of GaN: High-power RF gallium nitride (GaN) from infancy to manufacturable process and beyond,” ,IEEE Microw. Mag., vol. 14, no. 3, pp. 82–93, 2013,
  • A.Galetovic , “Patents in the History of the Semiconductor Industry: The Ricardian Hypothesis”,Oxford Acadimic,pages 21- c1,P201,2021
  • Tyler J. Flack, Bejoy N. Pushpakaran & Stephen B. Bayne, “GaN Technology for Power Electronic Applications: A Review”, Journal of Electronic Materials volume 45, pages 2673–2682 (2016).
  • H. Amano, “Growth of GaN Layers on Sapphire by LowTemperature-Deposited Buffer Layers and Realization of p-type GaN by Magesium Doping and Electron Beam Irradiation (Nobel Lecture),” Angew. Chemie - Int. Ed., vol. 54, no. 27, pp. 7764–7769, 2015.
  • U.K. Mishra, Yi-Feng Wu, B.P. Keller, S. Keller, S.P. Denbaars,“ GaN microwave electronics EEE Transactions on microwave theory and techniques, ” vol. 46, no. 6, june 1998,
  • S. Piotrowicz et al., “Overview of AlGaN/GaN HEMT technology for L- to Ku-band applications,” Int. J. Microw. Wirel. Technol., vol. 2, no. 1, pp. 105–114, 2010.
  • S. Piotrowicz ,E. Morvan , R.Aubry,“Overviewof AlGaN/GaN HEMT technology for L- to Ku-band applications”, . International Journal of Microwave and Wireless Technologies, 2010, 2(1), 105– 114.
  • S. Colangeli, A. Bentini, W. Ciccognani, E. Limiti, and A. Nanni, “GaN-based robust lownoise amplifiers,” IEEE Trans. Electron Devices, vol. 60, no. 10, pp. 3238–3248, 2013.
  • C. Sanabria et al., “Influence of epitaxial structure in the noise figure of AlGaN/GaN HEMTs,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 2, pp. 762– 768, 2005.
  • R. Nandi et al., “A New FieldEffect Transistor with Selectively Doped GaAs / nAlxGa1- x As Heterojunctions,” vol. 225, no. 17, pp. 1–2, 1980.
  • U. M. Constantine, “Analyse des transistors à effet de champ MESFET GaAs,” 2009.
  • P. Murugapandiyan, V. Rajya Lakshmi, N Ramkumar, P. Eswaran & Mohd Wasim .“ Gan -based high-electron mobility – power and high-frequency application: A. review,” Innovations in Electronics and coimmunisation Engineering 339–348
  • S. Colangeli, A. Bentini, W. Ciccognani, E. Limiti, and A. Nanni, “GaN-based robust lownoise amplifiers,” IEEE Trans. Electron Devices, vol. 60, no. 10, pp. 3238–3248, 2013, doi: 10.1109/TED.2013.2265718.
  • Y. Chen, “Nanofabrication by electron beam lithography and its applications: A review,” Microelectron. Eng., vol. 135, pp. 57–72, 2015.
  • B. J. van Wees, H. van Houten, C. W. J. Beenakker, J. G. Williamson, L. P. “Quantized conductance of point contacts in a two-dimensional electron gas Phys. Rev. Lett. 60, 848 .1988.
  • S. Firoz, R. K. Chauhan, and C. Engineering, “comparision of algan / gan and algaas / gaas based hemt device under,” Int. J. Adv. Eng. Technol., vol. 1, no. 2, pp. 12–19, 2011.
  • M. N. A. Aadit, S. G. Kirtania, and M. K. Alam, “Dependence of threshold voltage on doped layer thickness in AlGaN/GaN HEMT: An improved split donor E-mode design,” 2016 5th Int. Conf. Informatics, Electron. Vision, ICIEV 2016, pp. 681– 686, 2016.
  • X. G. He, D. G. Zhao, and D. S. Jiang, “Formation of twodimensional electron gas at AlGaN/GaN heterostructure and the derivation of its sheet density expression,” Chinese Phys. B, vol. 24, no. 6, pp. 1–6, 2015.
  • A. Douara, B. Djellouli, A. Rabehi, A. Ziane, and N. Belkadi, “I-V Characteristics Model for AlGaN / GaN HEMTs Using Tcad-Silvaco,” J. New Technol. Mater., vol. 4, no. 2, pp. 16–24, 2014.
  • A. Douara, A. Rabehi, B.Djellouli, A.Ziane, & H.Abid“2-D optimisation current–voltage characteristics in AlGaN/GaN HEMTs with influence of passivation layer,” International Journal of Ambient Energy , Pages 1363-1366.2018
  • D. Bouguenna, A. B. Stambouli, A. Zado, D. J. As, and N. M. Maaza, “2D Simulations of Current-voltage Characteristics of Cubic Al x Ga 1- x N / GaN Modulation Doped Heterojunction Field Effect Transistor Structures,” vol. 2, no. 5, pp. 309–315, 2012.

Abstract Views: 112

PDF Views: 70




  • Effect of Geometrical and Physical parameters of AlGaN/GaN HEMT on the electrical characteristics with AlN spacer layer

Abstract Views: 112  |  PDF Views: 70

Authors

Abdelmalek Douara
Faculty of Science and Technology, Tissemsilt University, Algeria
Abdelaziz
Laboratoire de Micro-électronique Appliquée. Université Djillali Liabès de Sidi Bel Abbés, BP 89, 22000, Sidi Bel Abbés, Algeria
Mostefa Hamdani
Faculty of Science and Technology, Tissemsilt University, Algeria

Abstract


The goal of this manuscript is to use the Silvaco Atlas TCAD simulator to investigate the effect of some parameters on the current-voltage characteristics of a high-electronmobility transistors devices based on AlxGa1-xN/GaN, Advanced AlxGa1-xN/AlN/GaN heterostructures with GaN channel layer and AlN spacer layer. It is demonstrated that numerical simulation can be used effectively in the development of HEMTs. We looked into the effect of the GaN thickness layer on the current-voltage characteristics, as well as the effect of the δ -doped layer within AlxGa1-xN barrier layer, the effect of the spacer thickness is also considered. Among the sample structures we used for our computations, our calculations reveal a low threshold voltage value and the maximum transconductance. Our structure with GaN channel layer thickness of 200 nm, Al content of x = 0.2 with a δ -doped layer of n = 5 x 1018 cm -3 , we find that the maximum saturation current.

Keywords


: Silvaco Atlas TCAD, AlxGa1−xN/GaN,δ-doped layer,HEMTs, AlN .

References