Performance Comparison of Junctionless FinFET with Nanosheet FET and Device Design Guidelines

In this paper, the junctionless Fin Field Effect Transistor (FinFET) and nanosheet Field Effect Transistor (NSFET) with a gate length of 12 nm are implemented using the Sentaurus Technology Computer-Aided Design (TCAD) tool. To compare the junctionless FinFET and NSFET, simulations are done at constant threshold voltage. The NSFET outperformed FinFET in terms of current driving capabilities, Subthreshold Swing (SS), Drain Induced Barrier Lowering (DIBL), and intrinsic voltage gain (A_V). Further, the device design guidelines are presented for FinFET and NSFET in terms of geometrical parameters. The simulation indicates that downscaling the gate length from 16 to 8 nm leads to an increase in SS and DIBL by 21 and 68.49 % in FinFET whereas 19 and 70.14 % in nanosheet FET. The height variation of FinFET seems to make the least impact on short channel effects (SCEs) while scaling the thickness of NSFET from 9 to 5 nm improves the DIBL and SS by 61.9 % and 15.54 % respectively. In the case of scaling the width of FinFET from 10 to 5 nm, DIBL and SS increase by 55.4 % and 14 % whereas scaling of nanosheet width from 24 to 12 nm gives 19.44 % and 1.37 % improvement in DIBL and SS, respectively.