ICTACT Journal on Microelectronics

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RF Circuit Realisation Using Thick Film Technology


Affiliations
1 Systems Engineering Group, U R Rao Satellite Centre, India
2 HMC and Indigenization Group, U R Rao Satellite Centre, India
     

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Thick film technology is mostly employed at lower frequency circuits such as hybrid micro circuits due to the associated losses of the paste. The characterisation and implementation of the conductive paste at higher frequencies is important so as to employ this technique at higher frequencies. Also the role of ceramic substrate due to higher dielectric losses needs detailed measurement to deduce the useful range of this technique with the selected paste. In this article simple transmission line using the thick film technology is fabricated, characterised and result of the thick and thin film technologies are compared. Subsequently RF circuits such as filter are fabricated using both thick and thin film fabrication technology and comparative analysis carried out. The line losses of 0.01 dB/cm up till 5 GHz is achieved using the standard gold paste. This article details the fabrication process, implementation methodology, design aspects, simulation and comparative analysis of the microstrip circuits such as transmission line and band pass filter.

Keywords

Thick Film, Microstrip, Band Pass Filter, Transmission Line.
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  • J.S. Hong and M.J. Lancaster, “Microstrip Filters for RF/Microwave Applications”, Wiley, 2001.

  • Kenganahalli G. Avinash and Inabathini Srinivasa Rao “Compact Dual-Mode Microstrip Bandpass Filters with Transmission Zeros using Modified Star Shaped Resonator”, Progress In Electromagnetics Research C, Vol. 71, pp. 177-187, 2017.

  • R. Wayne Johnson, Phil W. Rich, Debbie D. Rich and Larry K. Wilson, “Advances in Thick Film Conductors for Microwave Integrated Circuits”, Electro-Component Science and Technology, Vol. 6, pp. 215-218, 1980.

  • David M. Pozar, “Microwave Engineering”, John Wiley and Sons, 2010.

  • J.S. Hong and M.J. Lancaster, “Bandpass Characteristics of New Dualmode Microstrip Square Loop Resonators”, Electronics Letters, Vol. 31, No. 11, pp. 891-892, 1995.

  • Rashmi Behera and Venkatesh Darukesha, “Development of MMIC based C-Band LNA”, Proceedings of National Conference on Systems for Transforming India: Challenges and Opportunities, pp. 1-7, 2019.

  • Ajay Andhiwal, Usha Murthy and N.K. Pushpa, “High Density Thick Film Interconnects for Space Application”, Proceedings of International Symposium on Microelectronics, pp. 14-18, 2004.

  • K.C. Gupta and C. Garg, “CAD for Microstrip Circuits”, Artech House, 2015.

  • R A Zakarevicius, “Microwave Engineering using Microstrip Circuits”, Prentice Hall, 2016.

  • L G Maloratsky, “Reviewing the Basics of Microstrip Line”, Microwaves and RF, Vol. 39, No. 3, pp. 79-88, 2000.

  • Ayan Karamakar and K Singh, “Si-RF Technology”, Springer, 2019.

  • K C Gupta, “Microstrip Line and Slot Line”, 2nd Edition, Artech House, 2014.

  • Thomas H. Lee, “Planner Microwave Engineering-A Practical Guide to Theory, Measurement and Circuits”, Cambridge University Press, 2004.

  • Harsh Dashora, Jitendra Kumar and D. Mamatha, “Test Platform for RF Systems and Implementation using Planer Technique”, Proceedings of International Conference on Physical Sciences, pp. 1-17, 2020.

  • H.A. Wheeler, “Transmission Line Properties of Parallel Strips Separated by a Dielectric Sheet”, IEEE Transactions on Microwave Theory and Techniques, Vol. 13, No. 2, pp. 172-185, 1965.

  • K.V. Vamsi, A.V.G. Subramanyam and V.V. Srinivasan, “Miniaturized Micrsotrip High-Selectivity Bandpass Filters with Asymmetric Frequency Characteristics”, Proceedings of International Conference on Microwave, pp. 341-347, 2014.

  • C. Hua, C. Chen, C. Miao, and W. Wu, “Microstrip Bandpass Filters using Dual Mode Resonators with Internal Coupled Lines”, Progress in Electromagnetics Research C, Vol. 21, pp. 99-111, 2011.

  • I. Wolff and L. Knoppikn, “Microstrip Ring Resonator and Dispersion Measurement on Microstrip Lines”, Electronics Letters, Vol. 3, No. 2, pp. 779-781, 1971.

  • Mitsuo Makimoto and Sadahiko Yamashita, “Bandpass Filter using Coupled Stripline Steeped Impedance Resonators”, IEEE Transactions on Microwave Theory and Techniques, Vol. 28, No. 12, pp. 1-13, 1980.

  • Yaqeen S. Mezaal and Jawad K. Ali, “Investigation of Dual-Mode Microstrip Bandpass Filter Based on SIR Technique”, PLoS ONE, Vol. 11, No. 10, pp. 1-13, 2019.


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  • RF Circuit Realisation Using Thick Film Technology

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Authors

Jitendra Kumar
Systems Engineering Group, U R Rao Satellite Centre, India
Harsh Dashora
Systems Engineering Group, U R Rao Satellite Centre, India
Kamaljeet Singh
HMC and Indigenization Group, U R Rao Satellite Centre, India
P. Palani
HMC and Indigenization Group, U R Rao Satellite Centre, India
Ajay Andhiwal
HMC and Indigenization Group, U R Rao Satellite Centre, India

Abstract


Thick film technology is mostly employed at lower frequency circuits such as hybrid micro circuits due to the associated losses of the paste. The characterisation and implementation of the conductive paste at higher frequencies is important so as to employ this technique at higher frequencies. Also the role of ceramic substrate due to higher dielectric losses needs detailed measurement to deduce the useful range of this technique with the selected paste. In this article simple transmission line using the thick film technology is fabricated, characterised and result of the thick and thin film technologies are compared. Subsequently RF circuits such as filter are fabricated using both thick and thin film fabrication technology and comparative analysis carried out. The line losses of 0.01 dB/cm up till 5 GHz is achieved using the standard gold paste. This article details the fabrication process, implementation methodology, design aspects, simulation and comparative analysis of the microstrip circuits such as transmission line and band pass filter.

Keywords


Thick Film, Microstrip, Band Pass Filter, Transmission Line.

References