Journal of Surface Science and Technology

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Development and Characterisation of W and W-25% Ta Composite Coatings on Steel Material


Affiliations
1 School of Mechanical and Building Science, VIT University, Chennai Campus, Chennai - 600127, India
2 School of Applied Science, VIT University, Chennai Campus, Chennai - 600127, India
     

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Nanostructured Tungsten (W) and Tungsten-Tantalum (W-25% Ta) thin films are generated on Reduced Activation Ferritic Martensitic (RAFM) steel substrates. The developed thin films are then analysed for their adhesive strength, hardness and elastic modulus properties. The addition of Tantalum by 25% as a composite material in Tungsten thin-film coating has increased the ductility and decreased the hardness of the film at room temperature condition. Tantalum addition has decreased the adhesion capability of the Tungsten film to the steel substrate. In this study, adhesion analysis is qualitatively assessed by indentation test, and hardness along with modulus are calculated using nanoindentation test.

Keywords

RF Sputtering, Thin Films, Tungsten.
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  • Development and Characterisation of W and W-25% Ta Composite Coatings on Steel Material

Abstract Views: 355  |  PDF Views: 1

Authors

S. Lakshmi Kanth Konuru
School of Mechanical and Building Science, VIT University, Chennai Campus, Chennai - 600127, India
V. Umasankar
School of Mechanical and Building Science, VIT University, Chennai Campus, Chennai - 600127, India
Arun Kumar Sarma
School of Applied Science, VIT University, Chennai Campus, Chennai - 600127, India

Abstract


Nanostructured Tungsten (W) and Tungsten-Tantalum (W-25% Ta) thin films are generated on Reduced Activation Ferritic Martensitic (RAFM) steel substrates. The developed thin films are then analysed for their adhesive strength, hardness and elastic modulus properties. The addition of Tantalum by 25% as a composite material in Tungsten thin-film coating has increased the ductility and decreased the hardness of the film at room temperature condition. Tantalum addition has decreased the adhesion capability of the Tungsten film to the steel substrate. In this study, adhesion analysis is qualitatively assessed by indentation test, and hardness along with modulus are calculated using nanoindentation test.

Keywords


RF Sputtering, Thin Films, Tungsten.

References





DOI: https://doi.org/10.18311/jsst%2F2020%2F20109