Micro Thick Films Growth Problems on Low Temperature Cofired Ceramic Substrate in Pre-Firing Method

The present paper reports on the micro thick film growth problems on Low temperature co-fired ceramic technology. The focused interconnection technique is isothermal solidification to provide, power supply connection for micro heater. In this isothermal solidification process, the diffused amount of material and formation of intermetallic phase molecules depends on the surface growth , grain size of the micro thick films, resultant contact surface area with inter layer, temperature and density gradient between the base layer to solder layer. Surface growths of the silver thick film on LTCC substrate is studied with the help of SEM.