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Effect of Bonding Temperature on Microstructure and Mechanical Properties of AISI 304 to Ti-6Al-4V Diffusion Bonded Joints


Affiliations
1 Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalainagar, India
     

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Solid state diffusion bonding (DB) of Ti-6Al-4V and AISI 304 were studied in the temperature range of 600-1000°C with a constant pressure of 12 MPa and holding time of 60 minutes. Micro hardness measurements and the lap shear test were carried out to determine the hardness and strength of the joints respectively. Maximum lap shear strength of 138 MPa was attained in the joint that was diffusion bonded using a temperature of 900°C, holding time of 60 min and a bonding pressure of 12 MPa. Optical microscopy and scanning electron microscopy (SEM) were used to examine the grain growth and the fine details of the interface structure.

Keywords

Titanium, Diffusion Bonding, Dissimilar Joints, Micro Hardness.
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  • Effect of Bonding Temperature on Microstructure and Mechanical Properties of AISI 304 to Ti-6Al-4V Diffusion Bonded Joints

Abstract Views: 235  |  PDF Views: 3

Authors

A. Arun Negemiya
Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalainagar, India
S. Rajakumar
Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalainagar, India
V. Balasubramanian
Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalainagar, India

Abstract


Solid state diffusion bonding (DB) of Ti-6Al-4V and AISI 304 were studied in the temperature range of 600-1000°C with a constant pressure of 12 MPa and holding time of 60 minutes. Micro hardness measurements and the lap shear test were carried out to determine the hardness and strength of the joints respectively. Maximum lap shear strength of 138 MPa was attained in the joint that was diffusion bonded using a temperature of 900°C, holding time of 60 min and a bonding pressure of 12 MPa. Optical microscopy and scanning electron microscopy (SEM) were used to examine the grain growth and the fine details of the interface structure.

Keywords


Titanium, Diffusion Bonding, Dissimilar Joints, Micro Hardness.

References