Analysis on the Machining of Silicon Nitride Ceramic Materials through Electrochemical Discharge Machining Process

The electrochemical discharge machining (ECDM) process is a non-conventional, thermoelectric, hybrid machining process, which uses electrochemical discharge phenomenon and has a great potential to machine an electrically non-conducting engineering ceramic like Silicon Nitride (Si3N4). The present research paper highlights on the development of a second order non-linear mathematical model that establishes a relationship between the penetration rate and different process parameters such as applied voltage, electrolyte concentration and inter-electrode gap utilising the experimentally obtained data during micro-drilling of silicon nitride by electrochemical discharge machining process. The experimentation has been conducted according to the central composite second order rotatable design based on Response Surface Methodology (RSM). The analysis of variance (ANOVA) has been performed to verify the adequacy of the aforesaid polynomial mathematical model. The parametric effects have also been studied based on the developed mathematical model for obtaining optimal penetration rate during micro-drilling of Silicon Nitride by ECDM process.