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Wet Chemical Etching for Glass Micro-Machining


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1 Central Manufacturing Technology Institute, Bangalore, India
     

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In this paper, wet etching of Pyrex Glass using different chemicals is presented. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. The etch rates of Glass in different dilutions of HF (Hydrofluoric Acid) and BHF (Buffered Hydrofluoric Acid) are reported. Different agitation techniques are applied during process and results are compared. The improvement in the etching uniformity is achieved by string the solution continuously during etching time. Etch rate of Glass in HF solution is much higher than BHF solution and can be controlled based on concentration. Samples are characterized using Universal Length Measurement (ULM) system and optical profiler.

Keywords

Wet Etching, MEMS, Glass, Etch Rate.
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  • Nguyen Van Toan, Masaya Toda and Takahito Ono; An Investigation of Processes for Glass Micromachining; Micromachines 2016, 7, 51
  • Kirt R. Williams, , Kishan Gupta and Matthew Wasilik; Etch Rates for Micromachining Processing—Part II; Journal Of Microelectromechanical Systems, vol. 12, no. 6, December 2003.
  • Ciprian ILIESCU, Wet Etching of Glass for MEMS Applications, Romanian Journal Of Information Science And Technology, vol. 9, no. 4, 2006, 285-309

Abstract Views: 271

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  • Wet Chemical Etching for Glass Micro-Machining

Abstract Views: 271  |  PDF Views: 0

Authors

Megha Agrawal
Central Manufacturing Technology Institute, Bangalore, India
M. Sambhrama
Central Manufacturing Technology Institute, Bangalore, India

Abstract


In this paper, wet etching of Pyrex Glass using different chemicals is presented. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. The etch rates of Glass in different dilutions of HF (Hydrofluoric Acid) and BHF (Buffered Hydrofluoric Acid) are reported. Different agitation techniques are applied during process and results are compared. The improvement in the etching uniformity is achieved by string the solution continuously during etching time. Etch rate of Glass in HF solution is much higher than BHF solution and can be controlled based on concentration. Samples are characterized using Universal Length Measurement (ULM) system and optical profiler.

Keywords


Wet Etching, MEMS, Glass, Etch Rate.

References