Optimization of Micro-Electrochemical Discharge Machining of Silicon Nitride Ceramics Using Moora

Manufacturing of the better quality ceramic products with more accuracy and precision is a great challenge in the current industrial field. Electrically non-conducting materials like ceramics, composites, alumina, glass etc can be machined easily using Electrochemical Discharge Machining (ECDM) process. The performance characteristics of ECDM process e.g. material removal rate (MRR), machining depth rate (MDR), radial overcut (ROC) and heat affected zone (HAZ) are influenced by various process parameters such as applied voltage, inter-electrode gap, temperature, concentration of the electrolyte, type of electrolyte, shape, size and material of the electrode and also the nature of the power supply etc. This paper presents the optimization of m-EDMing of Silicon Nitride by utilizing Multi-Objective Optimization by Ratio Analysis (MOORA). Also, a multi choice decision analysis i.e. Analytic Hierarchy Process (AHP) is applied for optimization.