Design and Implementation of PLC Based Industrial Application Prototypes

Objectives: The objective of this work is to use the PLC techniques for atomization of industrial product manufacturing to achieve high throughput and improved quality and consistency. Software validation and hardware implementation used for demonstrating the ease of operation with this control along with tuning of the entire system for the three applications are presented. The results from programming and experimental setup are presented with system hardware and software details along with the agreement between count of total time taken for each operation and the time set in program. The agreement between the parameters set in the programs and experimental results are reported. Methods/Statistical Analysis: This paper presents a study by simulation and experimental models for three types of applications of PLCs. The applications reported are automatic mixing and bottle filling, automatic counting and packing and automatic sorting. A specific industrial PLC IndraLogic PLC and associated software, has been employed for the work presented. The verification of the logic is carried out using Ladder diagram and based on this logic hardware has been implemented. Findings: The results from programming and experimental setup are presented with system hardware and software details along with the agreement between count of total time taken for each operation and the time set in program. The agreement between the parameters set in the programs and the experimental results are verified. The time parameter for mixing of liquids and filling of bottles have been set up for 35 seconds, with other two applications timing working on sensing delay. The timing parameters setup for simulations closely agree with the hardware results. The counting of packaging and sorting has been also applied for varieties of Integrated circuits and can be easily extended to PCBs. Application/Improvements: Apart from the above mentioned industrial applications this technique can be extended to for packing of PCBs and ICS.