Design of D.C. Planer Magnetron Sputter for Preparing Copper-oxide Thin Films

A vacuum chamber (made up of stainless steel) and magnetron target (made up of copper) have been designed, manufactured and assembled. The sputtering target of pure copper make (dimensions 13 cm) involves cooling with (dimension 6.5 cm, with depth 3 cm) and it contains a circular magnet (6 x 3cm, an outer and inner diameter respectively). The chisel radius of target sputtering was about 9-11 cm. The systems have been tested with the pressure of 6x10^-5 mbar. The effective parameters of magnetron sputtering system operation have been collected including the pressure (75, 150, 300 and 450 mTorr), distance (3, 4, 5 and 6 cm) and voltage difference (218 to 310 Volt) between the target and the substrate. Finally, we have got maximum thickness on pressure point 300 mTorr, 3 cm distance and 220 Volt. An oxide copper thin film was deposited on different substrate including glass and optical the characteristics viz. optical energy gap, refractive index, extinction coefficient and real and imaginary dielectric constants were calculated.