Indian Journal of Science and Technology

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Thermal Management of Ethernet Switch Box


Affiliations
1 Department of Mechanical Engineering, SV Govt. Polytechnic, Tirupati–517507, India
2 CFD Analyst, Wipro Technologies, Bangalore, India
3 Department of Mechanical Engineering, JNTU College of Engineering, Kukatpally, Hyderabad–500072, India
 

In this study, thermal analysis for the design of a complex electronic enclosure, Ethernet switch box is designed. The Ethernet Switch in iDEN EBTS (integrated Digital Enhanced Network Enhanced Base Transceiver System) is required for deployment of quad two way BR (Base Radio). Most of the devices in the base case are above the allowable temperature limit without any air vents and heat enhancing devices. Hence suggested to provide heat sink that enhances heat transfer on the critical components and operating well below the allowable temperature. In this paper, the investigations are carried for the improvement of device performance with the help of heat sink and side vents on the enclosure that increases the heat transfer. The complete analysis is carried out with commercial CFD (Computational Fluid Dynamics) software, Fluent V 6.1.22.

Keywords

BR - Base Radio, CFD - Computational Fluid Dynamics, PCB - Printed Circuit Board, IC - Integrated Circuit, FR4 -Fire Retardant 4 Grade, BCM - Bus Converter Module
User

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  • Thermal Management of Ethernet Switch Box

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Authors

G. Venkata Subbaiah
Department of Mechanical Engineering, SV Govt. Polytechnic, Tirupati–517507, India
Y. Suresh Reddy
CFD Analyst, Wipro Technologies, Bangalore, India
K. Vijay Kumar Reddy
Department of Mechanical Engineering, JNTU College of Engineering, Kukatpally, Hyderabad–500072, India

Abstract


In this study, thermal analysis for the design of a complex electronic enclosure, Ethernet switch box is designed. The Ethernet Switch in iDEN EBTS (integrated Digital Enhanced Network Enhanced Base Transceiver System) is required for deployment of quad two way BR (Base Radio). Most of the devices in the base case are above the allowable temperature limit without any air vents and heat enhancing devices. Hence suggested to provide heat sink that enhances heat transfer on the critical components and operating well below the allowable temperature. In this paper, the investigations are carried for the improvement of device performance with the help of heat sink and side vents on the enclosure that increases the heat transfer. The complete analysis is carried out with commercial CFD (Computational Fluid Dynamics) software, Fluent V 6.1.22.

Keywords


BR - Base Radio, CFD - Computational Fluid Dynamics, PCB - Printed Circuit Board, IC - Integrated Circuit, FR4 -Fire Retardant 4 Grade, BCM - Bus Converter Module

References





DOI: https://doi.org/10.17485/ijst%2F2013%2Fv6i10%2F38770