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Hadi, Fadhel Yousif
- Design of D.C. Planer Magnetron Sputter for Preparing Copper-oxide Thin Films
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Authors
Affiliations
1 Department of Physics, College of Science, University of Baghdad, Baghdad, Iraq
1 Department of Physics, College of Science, University of Baghdad, Baghdad, Iraq
Source
Indian Journal of Science and Technology, Vol 4, No 12 (2011), Pagination: 1704-1709Abstract
A vacuum chamber (made up of stainless steel) and magnetron target (made up of copper) have been designed, manufactured and assembled. The sputtering target of pure copper make (dimensions 13 cm) involves cooling with (dimension 6.5 cm, with depth 3 cm) and it contains a circular magnet (6 x 3cm, an outer and inner diameter respectively). The chisel radius of target sputtering was about 9-11 cm. The systems have been tested with the pressure of 6x10-5 mbar. The effective parameters of magnetron sputtering system operation have been collected including the pressure (75, 150, 300 and 450 mTorr), distance (3, 4, 5 and 6 cm) and voltage difference (218 to 310 Volt) between the target and the substrate. Finally, we have got maximum thickness on pressure point 300 mTorr, 3 cm distance and 220 Volt. An oxide copper thin film was deposited on different substrate including glass and optical the characteristics viz. optical energy gap, refractive index, extinction coefficient and real and imaginary dielectric constants were calculated.Keywords
Optical Properties, Sputtering, Thin Films, DC Magnetron SputteringFull Text
References
- Berger B Ph.D Thesis (2001) Development and tribological characterization of magnetron sputteringTiB2 and Cr/CrN coatings. Assist to Acta. Univ.
- Bhuvaneswari HB, Nithiya Priya I, Chandramani R, Reddy VR and Mohan Rao G (2003) Studies on zirconium nitride films prepared by reactive magnetron sputtering. Cryst. Res. Technol. 38, 1047-1051.
- Chapman B (1980) Glow discharge process. John Wiley and Sons, NY.
- Hass G (1966) Physics of thin film. Academic press, NY.
- Lieberman MA and Allan Lichtenberg J (1994) Principles of plasma discharges and materials processing. John Wiley & Sons, Inc. NY
- Mahdi Hasan Suhail (1992) Reactive magnetron sputtering-plasma analysis and studies on oxide films. Ph. D. Thesis, IISc. India.
- Masissel LI and Glang R (eds.) (1979) Handbook of thin film technology. McGraw Hill, NY.
- Nyaiesh AR (1981) The characteristics of a planar magnetron operated at a high power input. Thin Solid Films. 86 (2-3), 267-277.
- Nyaiesh AR and Elphick C (1985) Design and construction of a small electromagnetron for sputtering use. Vac. 35 (4-5), 207-208.
- Panwar NS, Vargheese Kd and Mohan Rao G (1997) Design and performance study of a scanning magnetron sputtering target. Rev. Sci. Instrum. 68 (4), 1858-1859.
- Poate JM, TU K N and Mayer JW (1978) Thin film interdiffusion and reaction. John Wiley & Sons. Inc.
- Posadowski WM (1999) Pulsed magnetron sputtering of reactive compounds. Thin Solid Films. 343-344, 85-89.
- Proud J (ed.) (1991) Plasma processing of materials, scientific opportunities andTechnological Challenges. National Acad. Press,Washington. D.C.
- Rastogi RS, Vankar DV and Chopra KL (1987) Optimization studies on magnetic field geometry forplanar magnetron. Rev. Sci. Instrum. 58 (4), 1505-1509.
- Knizikevicis Rimantas (2010) Simulation of reactive sputter deposition of TiO2 films. ISSN 1392–1320 Mat.Sci. (Medziagotyra). 16(3), 202-204.
- Serianni G, Antoni V, Cavazzana R, Maggioni G, Martines E, Pomaro N, Rigato V and Spolaore M &Tramontin L(2000) Plasma characterization of a Dcclosed field magnetron sputtering device. 27th EPSConf. Contr. Fusion and Plasma Phys. Budapest. ECA 24B, 17-20.
- Singh M, Srivastava S, Agarwal S, Kumar S and Vijay YK (2010) Optical properties of DC magnetron sputtered tantalum and titanium nanostructure thinfilm metal hydrides. Bull. Mat. Sci. 33 (5), 569–573.
- Smith DL (1995) Thin-film deposition: Principles and practice. McGraw-Hill, Inc. NY. U.S.A.
- Spencer AG and Howson RP (1988) Rf oscillations in DC planer sputtering magnetron.Vac. 38 (7), 497-498.
- Spencer AG, Bishop CA and Howson RP (1987) The design and performance of planar magnetron sputtering cathodes. Vac. 37 (3-4), 363-366.
- Thornton JA (1975) Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings. J. Vac. Sci. Technol. 12, 830-835.
- Veldeman J, Jia H and Burgelman M (1999) Influence of magnetron configuration on CoCr films sputtered on flexible substrates. J. Magnetism & Magnetic Materials. 193, 128-131.
- Vesson JL and Kern W eds (1985) Thin film processes. Acad. NY.
- Yamagishi M, Kuriki S, Song P K and Shigesato Y (2003) Thin film TiO2 photocatalyst deposited by reactive magnetron sputtering. Thin Solid Films. 442(1-2), 227–231.