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Piezo-Resistive Mems Pressure Sensor for Tire Bead Seating Pressure Measurement:Design, Simulation, Analysis and Fabrication Process


Affiliations
1 Sensor and Vision Technology Deaprtment Central Manufacturing Technology Institute, Bengaluru, India
2 Department of Instrumentation and Control Engineering SRM University, Kattankulathur, Tamil Nadu, India
     

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Understanding the tire behavior during tire inflation is critical to design a high- performance tire. To improve handling and response, tire manufacturers need to understand the changes of a tire under various conditions. A MEMS pressure sensor can be placed on the rim to make contact with the tire bead, and can measure the pressure distribution of a tire across the sensor face. Considering the unique nature of each sensor and the trade-offs in design, it is not feasible to follow a standard design approach. Thus, it is useful to derive the specific design, considering number of important factors to arrive at the ‘ideal’ design. The selection of appropriate parameters of piezoresistors such as the shape and the position of the piezoresistor on the pressure sensor diaphragm, thickness of diaphragm are important. This research work shows the scope of using analytical solutions and design techniques for a development of piezoresistive pressure sensor. This research work also focuses on piezoresistive pressure sensor principles, design, modeling, parameters to be considered, materials that can be used in MEMS fabrication. Here the MEMS fabrication process has been discussed in brief pertaining to the application and feature size. Few models of piezoresistive based MEMS pressure sensors have been simulated, analysed and the results are presented.

Keywords

Piezoresistivity, Sensitivity, Pressure Sensor, MEMS.
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  • K. N. Bhat and M. M. Nayak, MEMS Pressure Sensors- An Overview of Challenges in Technology and Packaging, Journal of Institute Of Smart Structures And Systems (ISSS), Vol. 2, No.1, pp39-71, March 2013

  • Bhat KN (2007) Silicon micromachined pressure sensors. J Indian Inst Sci 87(1):115–131, Bhat, K.N.,Vinoth Kumar, V.,Sivakumar, K., Madhavi, S.P., DasGupta, A., Rao, P.R.S., Bhattacharya, E., DasGupta, N. Manjula, S.R., Daniel, R.J., & Natarajan, K., 2006 “Silicon Micromachining for MOS Integrated Piezoresistive pressure Sensors with SOI approach,” Indo-Japan Joint Seminar on ‘Micro-Nano Manufacturing Science. Tokyo, pp. 19 - 26.

  • S. Santosh Kumar, B. D. Pant, Polysilicon thin film piezoresistive pressure microsensor: design, fabrication and characterization, Springer-Verlag Berlin Heidelberg 2014

  • S. Santosh Kumar and B. D. Pant, A Study of Analytical Solutions of Plate Equation for Pressure Microsensor Diaphragm: Limitations, Comparison and Usage, Journal of Microelectronics, Electronic Components and Materials Vol. 45, No. 1 (2015), 80–86

  • S. Santosh Kumar and B. D. Pant, Fabrication and Characterization of Pressure Sensor, and Enhancement of Output Characteristics by Modification of Operating Pressure Range, IEEE 2015

  • S. Santosh Kumar and B.D. Pant, Design of Piezoresistive MEMS Absolute Pressure Sensor, 16th International Workshop on Physics of Semiconductor Devices, Proc. of SPIE Vol. 8549 85491G-1

  • S. Santosh Kumar, Anuj K. Ojha, B. D. Pant, Experimental evaluation of sensitivity and non‑linearity in polysilicon piezoresistive pressure sensors with different diaphragm sizes, Springer-Verlag Berlin Heidelberg 2014

  • S. Santosh Kumar, Anuj K. Ojha, Manish Kumar, and B. D. Pant, Comparative study of characteristics of polysilicon pressure sensor with different diaphragm sizes and piezoresistor configurations, Citation: 1724, 020094 (2016)

  • S. Santosh Kumar, B. D. (2014). Design principles and considerations for the ‘ideal’ silicon. Verlag Berlin Heidelberg: Microsyst Technol, Springer.

  • Tai-Ran Hsu. MEMS & Microsystems Design and Manufacture, China Machine Press: Beijing, 2002; pp. 284-289.

  • Thyagarajan V, Bhat KN (2013) Optimum location for piezoresistors with square diaphragm pressure sensor. In: Proceedings of 6th ISSS national conference on MEMS, smart material, structures and systems

  • Timoshenko, S. P., and S. Woinowski-Krieger, 1983, Theory of Plates and Shells, New York:McGraw- Hill.

  • Tsai HH, Hsieh CC, Fan CW, Chen YC, Wu WT (2009) Design and characterization of temperature-robust piezoresistive micropres- sure sensor with double-wheatstone-bridge structure. In: Pro- ceedings of the symposium on design, test, integration and pack- aging of MEMS/MOEMS, Rome, pp 363–368

  • Vandelli, N., 2008 “SiC MEMS Pressure Sensors For Harsh Environment Applications”, MicroNano News , pp10-12 (April).

  • Vinoth Kumar, V., 2006 Design and Process Optimization for Monolithic Integration of Piezoresistive Pressure Sensor and MOSFET Amplifier with SOI Approach, MS Thesis, Electrical Engineering Department, Indian Institute of Technology, Madras, India.

  • Vinoth Kumar, V., A. DasGupta , K.N.Bhat and K. Natarajan, 2006, “Process Optimization for monolithic integration of piezoresistive pressure sensor and MOSFET Amplifier with SOI Approach,” Journal of Physics Conference Series, Vol.34., pp. 210-215

  • Wong V.T.S. et al., 2000, “Bulk Carbon Nanotubes as Sensing Element for Temperature and Anemometry Micro Sensing”, Proc. IEEE MEMS 2003, pp. 41- 44,

  • Fujitsuka N, Hamaguchi K, Funabashi H, Kawasaki e, Fukada T (2004) aluminum protected silicon anisotropic etching tech- nique using TMaH with an oxidizing agent and dissolved Si. R&D Rev Toyota CRDL 39(2):34–40

  • Fuller LF, Surdigo S (2003) Bulk micromachined pressure sensor. In: Proceedings of the 15th Biennial University/ Government/Indus- try Microelectronics Symposium, pp 317–320

  • Fung, C. K. M. ,Zhang M Q. H. Zhang , Dong Z., and Li, W. J., 2005, “Fabrication of CNT-Based MEMS Piezoresistive Pressure Sensors Using DEP Nano assembly” IEEE MEMS, pp.251-254.

  • Middlelhoek, S. & Audet, S.A., 1989, Silicon Sensors, San Diego, Academic Press.

  • Mohamed, N. M., Lai M. K. and Begam K. M., 2010, “Development of Aligned Carbon Nanotubes (CNTs) for Pressure Sensing Application”, NSTI- Nanotech, Vol.2, 130-133

  • Mosser,V., Susuki,J.,Goss,J, & Obermeier, E., 1991, “Piezoresistive Pressure Sensors Based on Polycrystalline Silicon,” Sensors and Actuators A,Vol.28, pp 113-132.

  • Narayanaswamy M, Daniel RJ, Sumangala K, Jeyasehar Ca (2011) Computer aided modelling and diaphragm design approach for high sensitivity silicon-on-insulator pressure sensors. Measurement 44:1924–1936


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  • Piezo-Resistive Mems Pressure Sensor for Tire Bead Seating Pressure Measurement:Design, Simulation, Analysis and Fabrication Process

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Authors

N. Kusuma
Sensor and Vision Technology Deaprtment Central Manufacturing Technology Institute, Bengaluru, India
E. S. Sujit
Department of Instrumentation and Control Engineering SRM University, Kattankulathur, Tamil Nadu, India

Abstract


Understanding the tire behavior during tire inflation is critical to design a high- performance tire. To improve handling and response, tire manufacturers need to understand the changes of a tire under various conditions. A MEMS pressure sensor can be placed on the rim to make contact with the tire bead, and can measure the pressure distribution of a tire across the sensor face. Considering the unique nature of each sensor and the trade-offs in design, it is not feasible to follow a standard design approach. Thus, it is useful to derive the specific design, considering number of important factors to arrive at the ‘ideal’ design. The selection of appropriate parameters of piezoresistors such as the shape and the position of the piezoresistor on the pressure sensor diaphragm, thickness of diaphragm are important. This research work shows the scope of using analytical solutions and design techniques for a development of piezoresistive pressure sensor. This research work also focuses on piezoresistive pressure sensor principles, design, modeling, parameters to be considered, materials that can be used in MEMS fabrication. Here the MEMS fabrication process has been discussed in brief pertaining to the application and feature size. Few models of piezoresistive based MEMS pressure sensors have been simulated, analysed and the results are presented.

Keywords


Piezoresistivity, Sensitivity, Pressure Sensor, MEMS.

References