Development and Performance Evaluation of Self Adhesive Sputtered Thin Film Strain Gauges

In many industrial and academic applications force, pressure and displacement are measured using strain gauges bonded with adhesives on the object to be tested. This paper presents development and performance investigation of non-intrusive self adhesive Thin Film Strain Gauges (TFSGs) for applications demanding quick gauge installation on test objects; eliminating a conventional step of applying adhesives for installation and curing. Self adhesive TFSGs of NiCr (metal alloy) and ITO (degenerate semiconductor) are fabricated. Distinction in the piezoresistive responses and gauge factor of metal alloy and degenerate semiconductor thin film strain gauges are measured and studied by cantilever beam bending method.