Table of Contents
Vol 19, No 10 (2020)
Open Access
Subscription Access
Technical Paper
| Design and fabrication of platinum Thin-Film based Temperature Sensor | ||
| M. K. Mayuresh, S. Harsha, S. Usha | ||
| Vol 19, No 10 (2020), Pagination: 3-11 | ||
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| Micro 3d-fabrication Of Ceramic Components Using Projection Micro-stereolithography Technique | ||
| Arun Christopher Thomas, Harikrishna Satish Thota, Dipak Vasant Chaudhari | ||
| Vol 19, No 10 (2020), Pagination: 13-19 | ||
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| Computational Study on Ion Dynamics of Mems Quadrupole Mass Filter | ||
| B. Anitha, Supriya Gogulapati, Deepak Kumar Sharma, J. John, M. S. Giridhar, Ashwini Jambhalikar | ||
| Vol 19, No 10 (2020), Pagination: 20-26 | ||
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| Development and Performance Evaluation of Self Adhesive Sputtered Thin Film Strain Gauges | ||
| Shreyas P. Bhat, B. Pavithra, S. H. Bharathi, M. M. Nayak | ||
| Vol 19, No 10 (2020), Pagination: 27-32 | ||
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| Performance Analysis of Polyvinylidene Fluoride (PVDF) Type Piezoelectric Pressure Sensor | ||
| R. Sundaraguru, S. Shanthana, B. R. Sree Lakshmi, Veda Sandeep | ||
| Vol 19, No 10 (2020), Pagination: 33-38 | ||
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| Simulation Study for Reduction in Natural Frequency and Stiffness of Meander Structure with Constant Device Dimension | ||
| Khawaja Nizammuddin Subhani, Shubham Khandare, Rajashekhar C. Biradar, K. N. Bhat | ||
| Vol 19, No 10 (2020), Pagination: 39-43 | ||
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| Array Microchannels Formation in Glass Workpiece using Multi-Pass Electrochemical Discharge Milling Technique | ||
| Dileep Kumar Mishra, Julfekar Arab, Pradeep Dixit | ||
| Vol 19, No 10 (2020), Pagination: 44-48 | ||
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| Design and Fabrication of Sculptured Diaphragm Mems Low Range Pressure Sensor | ||
| Nithin, Rathnamala Rao, K. N. Bhat | ||
| Vol 19, No 10 (2020), Pagination: 49-53 | ||
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| Effective and Active Temperature Compensation of High-Pressure Mems Pressure Transducers for Aerospace Applications | ||
| B. Pavithra, C. Linet Thomas, N. Veera Pandi, K. Sankaran, Nithin, Smitha G. Prabhu, K. N. Bhat | ||
| Vol 19, No 10 (2020), Pagination: 54-57 | ||
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| Low Temperature Anodic Bonding Process with Silicon-Gold-Glass Interface for Wafer Level Packaging Applications | ||
| P. Ravi Teja Naidu, Vijay Kumar, Jaspreet Singh | ||
| Vol 19, No 10 (2020), Pagination: 59-63 | ||
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| Miniature Hexapod Archio Robot | ||
| R. Suraksha, K. Nagarathna, D. Bindu, J. Gaganashree | ||
| Vol 19, No 10 (2020), Pagination: 64-68 | ||
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